Transparent 400 Point Solderless Breadboard / Protobloc With Adhesive Backing

Description

A Solderless Breadboard / Protobloc with a total of 400 tie points consisting of two sets of 30 rows of 5 inter-connected sockets. Features: • 4 rows of 30 interconnected sockets suitable for use as power supply rails • All contact positions are clearly defined on an alphanumeric grid • Transparent ABS polymer board mounted on an adhesive foam base • Hole Pitch:2.54mm • Lead Diameter Max:0.8mm • Lead Diameter Min:0.3mm • No. of Holes:400 • PCB Hole Diameter:0.8mm • Pitch Spacing:2.54mm • Row Pitch:2.54mm • Self-adhesive foam backing pad • board dimensions: 82 x 55 x 10 mm • ships shrink wrapped and un-used