🔧 Elevate Your Repair Game with Precision!
The Hilitand Universal BGA Reballing Stencil is a high-quality tin mesh solder template designed for efficient IC chip repairs in smartphones. With a pitch range of 0.3mm to 0.5mm and made from durable stainless steel, this stencil ensures precision and reliability. Its lightweight and compact design allows for easy transport and quick installation, making it an essential tool for any tech-savvy professional.
| Manufacturer | Hilitand |
| Part number | Hilitanducin65e2bs |
| Item Weight | 14 g |
| Package Dimensions | 15.24 x 11.43 x 0.03 cm; 14 g |
| Item model number | Hilitanducin65e2bs |
| Material | stainless_steel |
| Batteries Included? | No |
| Batteries Required? | No |
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